J&F Rosin Core 63/37 Leaded Solder is ideal for electronics soldering. The combination of 63% tin to 37% lead is a eutectic ratio, meaning it has the lowest melting point of any other combination of tin to lead solder, and a lower melting point than either of the two parts by themselves. This makes it ideal for working on electronics circuitry which can be damaged by high temperatures. It also features an exact melting point which lends itself to accuracy when creating solder joints on circuit boards, a task in which precision is of the utmost importance.
Composition: 63% Tin, 37% Lead
Melting Point: 184.5°C / 361.4 °F